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  preliminary datasheet R1EX25512ASA00A r1ex25512ata00a serial p e ripheral interfac e 512k e eprom (64-kword 8-bit) r10 d s0 046e j02 0 0 rev.2.00 oct.04, 201 0 description r1ex25xxx se ries is the seria l pe ripheral interface c o m p atible (spi) e e prom (electric a lly erasable a n d pro g rammab l e rom). th ey realize h i g h sp eed , l o w power co nsu m p tio n an d a h i gh lev e l of reliab ility by e m p l o y in g adva nce d m o no s m e m o ry t echn o l o gy a n d c m os pr ocess an d l o w v o l t a ge ci rc ui t r y t echn o l o gy . t h ey al so ha ve a 12 8 - by t e page pr o g ram m i ng f unct i o n t o m a ke t h ei r wri t e op erat i o n fast er . note: renesas electronics' seri a l ee p r o m s ar e au tho r iz ed for us in g c o n s u m er applications s u ch as cellular phones , cam c orde rs a n d a udi o e qui p m ent s . t h ere f ore , pl ease co n t act r e nesas el ect ro ni cs' sal e s o ffi ce bef o re u s i n g industrial applications s u c h as autom o tive sy st em s, em bedd ed c ont rol l e rs and m e t e rs. features ? si ngl e su p p l y : 1. 8 v t o 5. 5 v ? serial peri phe ral interface c o m p atible (spi bus) ? spi m o d e 0 (0 ,0 ), 3 (1 ,1) ? c l ock fre q u enc y : 5 m h z ( 2 . 5 v t o 5. 5 v) , 3 m h z ( 1 . 8 v t o 5. 5 v) ? po wer di ssi pat i on: ? stan db y: 5 a (m ax) ? active (read ): 5 m a (m ax) ? active ( write): 5 m a (m ax) ? a u t o m a t i c p a ge wr ite: 12 8- byte/p a g e ? write cycle time: 5 m s ( m a x ) ? endurance: 1,000k cycles @25 c ? data reten tio n : 100 years @2 5 c ? sm a ll size p ack ag es: sop-8p in , tssop-8 p in ? shipping ta pe and reel ? tsso p-8p in : 3 , 00 0 i c /r eel ? sop - 8pi n : 2 , 5 0 0 ic / r eel ? tem p erature ra nge: ? 40 to + 85 c ? lead f r e e pr odu ct. r10ds 0 0 46ej 020 0 rev.2.00 page 1 of 2 0 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a ordering information ty pe no. inte rna l orga n i za tion ope r a t ing v o lta g e f re que nc y pa c k a g e 5 mhz (2.5 v to 5.5 v) r1e x 2 551 2as a 00a 512k b i t (6553 6 8-pin sop/tssop (t op view) 1 2 3 4 8 7 6 5 v cc hold c d s q w v ss pin description pin na me func tio n c s e r i a l c l o c k d serial data input q serial d a ta out put s chip se lect w w r ite protect hold hold v cc s u p p l y v o ltag e v ss g r o u n d r10ds 0 0 46ej 020 0 rev.2.00 page 2 of 2 0 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a block diagram high voltage generator memory array y -select & sense amp. serial-parallel converter address generator control logic y decoder x decoder v cc v ss s w c hold d q absolute maximum ratings para mete r s y m b o l v a l u e u n i t supp l y v o ltag e relative to v ss v cc ? 0.6 to +7.0 v input voltag e relative to v ss v in ? 0.3 to v cc +0.3 v operatin g temperatur e rang e * 1 t o p r ? 40 to + 85 c storage temp e r ature ran ge t s tg ? 55 to + 125 c notes: 1. includi ng e l ectr ical c har acteris t ics and data r e tentio n. dc operating conditions pa rame t e r s y m b o l m i n ty p ma x u n i t v cc 1 . 8  5 . 5 v supp l y v o ltag e v ss 0 0 0 v v ih v cc 0.7  v cc + 0.3 v input voltag e v il ? 0.3  v cc 0.3 v operatin g temperat ur e rang e t opr ? 40  + 85 c capacitan ce (ta = + 2 5 c, f = 1 mhz) pa rame t e r s y mbol m i n ty p ma x u n i t te s t c onditi o n s input capac itan ce (d,c, s , w , h old ) c i n * 1   6.0 pf vin = 0 v output capacit ance (q) c i/o * 1   8.0 pf vout = 0 v note: 1. not 100 % tested. r10ds 0 0 46ej 020 0 rev.2.00 page 3 of 2 0 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a memor y cell characteristics (v cc = 1. 8 v t o 5. 5 v) t a =2 5 c t a =8 5 c n o t e s endur ance 1,000k c y c l es min. 100k c y cl es mi n. 1 data retenti on 100 ye ars min. 10 years mi n. 1 notes: 1. not 100 % tested data at shipment ? ? dc characteristics pa rame t e r s y m b o l m i n ma x u n i t te s t c onditi o n s input leak ag e current i li ? 2 a v cc = 5.5 v, v in = 0 to 5.5 v ( s , d, c, hol d , w ) output leaka g e current i lo ? 2 a v cc = 5.5 v, v out = 0 to 5.5 v (q) standb y i sb ? 5 a v in = v ss or v cc , s = v cc v cc = 5.5 v ? 3 m a v cc = 3.3 v, r ead at 5 mhz v in = v cc 0.1 / v cc 0.9 q = open i cc1 ? 5 m a v cc = 5.5 v, r ead at 5 mhz v in = v cc 0.1 / v cc 0.9 q = open ? 3 m a v cc = 3.3 v, write at 5 mhz v in = v cc 0.1 / v cc 0.9 v cc current active i cc2 ? 5 m a v cc = 5.5 v, write at 5 mhz v in = v cc 0.1 / v cc 0.9 v ol1 ? 0 . 4 v v cc = 2.5 to 5.5 v, i ol = 2 ma v ol2 ? 0 . 4 v v cc = 1.8 to 2.5 v, i ol = 1.5 ma v oh1 v cc 0.8 ? v v cc = 2.5 to 5.5 v, i oh = ? 2 ma output voltage v oh2 v cc 0.8 ? v v cc = 1.8 to 2.5 v, i oh = ? 0.4 ma r10ds 0 0 46ej 020 0 rev.2.00 page 4 of 2 0 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a ac characteristics test conditions ? ? ? ? ? ? ? + ? + para mete r s y m b o l a l t min m a x un i t no t e s clock freq uenc y f c f sc k ? s active setup time t slc h t c ss1 9 0 ? s not active se tup time t s hch t c ss2 9 0 ? s desel ect time t sh sl t cs 9 0 ? s active hol d time t chs h t cs h 9 0 ? s not active hold time t chs l ? ? ? ? ? ? ? ? hold not active t hhch ? ? hold active t hl ch ? ? hold active t chhl ? ? hold not active t chhh ? ? ? ? ? ? ? hold hig h to output lo w - z t hhqx t lz ? hold lo w to output lo w - z t hl qz t hz ? ? + %
r1ex25 512 asa00 a /r1ex2551 2ata00 a (ta = ? 40 t o + 85 c, v cc = 1. 8 v t o 5 . 5 v ) para mete r s y m b o l a l t min m a x un i t no t e s clock freq uenc y f c f sc k ? s active setup time t slc h t c ss1 1 0 0 ? s not active se tup time t s hch t c ss2 1 0 0 ? s desel ect time t sh sl t cs 2 5 0 ? s active hol d time t chs h t cs h 1 0 0 ? s not active hold time t chs l ? ? ? ? ? ? ? ? hold not active t hhch ? ? hold active t hl ch ? ? hold active t chhl ? ? hold not active t chhh ? ? ? ? ? ? ? hold hig h to output lo w - z t hhqx t lz ? hold lo w to output lo w - z t hl qz t hz ? ? + %
r1ex25 512 asa00 a /r1ex2551 2ata00 a timing wa veforms serial input timing s c t chsl t slch t chdx t clch t chcl t shch t chsh t shsl t dvch msb in lsb in d q high impedance hold timing t chhl s hold c d q t hlch t chhh t hlqz t hhqx t hhch outpu t timing s c d q lsb out addr lsb in t qlqh t qhql t shqz t ch t cl t clqv t clqx t clqv t clqx r10ds 0 0 46ej 020 0 rev.2.00 page 7 of 2 0 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a pin function serial d a t a ou tpu t (q) thi s out put si g n al i s used t o t r ansfe r dat a se ri al l y out o f t h e d e v i ce. data is sh i f ted ou t on th e fallin g edge of serial cl ock (c ) . serial d a ta in put (d) this input signal is use d to tra n sfe r data se rially into the device. it receives instructions, a d dresses , a n d the data to b e written . valu es are latch e d o n th e rising ed g e of serial clo c k (c). serial clock (c) th is inpu t signal p r ov id es t h e ti min g o f th e serial in terface. i n st r u ct i ons , a d d r esses , or da t a prese n t at se ri al dat a i n p u t ( d ) are l a t c hed o n t h e ri s i ng e d ge of ser i al cl ock (c ). dat a o n seri al dat a o u t p ut (q ) cha nge s aft e r t h e fal l i ng edge o f se ri al c l ock (c ) . chip select ( s ) w h en t h is input sig n a l is h i gh , th e d e v i ce is deselected and ser i al d a ta o u t pu t (q ) is at h i gh im p e d a n ce. u n less an in tern al write cycle is in progress, th e d e v i ce will b e in th e stan db y m o d e . dri v ing ch ip select ( s ) l o w en ab les th e d e v i ce, p l acing it in th e activ e po wer m o d e . after power-up , a falling ed ge on ch ip select ( s ) is requ ired p r i o r t o th e start of an y in stru ction . hold ( hold ) the hold ( hold ) signal is used t o pause any serial communications with th e d e v i ce with ou t d e selecting th e d e v i ce. during t h e h o l d co nd itio n, the serial d a ta outp u t (q) is h i gh i m p e d a n c e, and serial d a ta in p u t (d) and serial clo c k (c) are d o n ? t care. to start th e hold cond itio n , the de vice m u st be selected, with chi p select ( s ) dri v en lo w. write pr otec t ( w ) the m a in purpose of this i n put signal is t o freeze the size of the a r ea of m e m o ry that is protected a g ainst write i n st ruct i o ns (as speci fi e d by t h e val u e s i n t h e b p 1 a n d b p 0 b i t s of t h e st at us re gi st er). t h i s pi n m u st be dr i v en ei t h e r hi g h or l o w, a n d m u st be st a b l e d u ri ng al l wri t e ope rat i o ns. r10ds 0 0 46ej 020 0 rev.2.00 page 8 of 2 0 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a functional description statu s re gis t er th e f o llow i ng f i gu r e show s t h e status re gi st er f o rm at . the st at u s r e gi st er co nt ai ns a num ber of st at us a n d c ont r o l bi t s t h at ca n be rea d or set (as ap propriate) by speci fic i n structions. statu s re gis t er forma t srwd 0 0 0 bp1 bp0 wel wip b7 status register write disable block protect bits write enable latch bits write in progress bits b0 wip b it: th e write in prog ress (wip) b it i n d i cates wh ether th e m e m o ry is bu sy with a write o r write statu s reg i ster cycle. wel b it: th e write en ab le latch (wel) bit in d i cates th e statu s of t h e in t e rn al write enab le latch. bp1 , bp0 b its: th e blo c k pro t ect (bp1 , b p 0 ) b its are n o n - v o l atile. th ey d e fi n e th e size o f th e area to be software pr ot ect ed a g ai n s t w r i t e i n st ru ct i ons. b p 1, b p 0 a r e ? 0 ? st a t us at s h i p m e nt . sr wd b it: the statu s reg i ster write disable (sr w d) b it is op erated in co nju n c tion with th e write pro t ect ( w ) si gnal . the status re gister write dis a bl e ( s r w d) bi t an d wri t e pr ot ect ( w ) signal allo w th e d e v i ce to b e pu t in th e hard ware pro t ected m o de. in th is m o de, th e no n-v o l atile b its o f t h e statu s reg i ster (sr w d, bp1 , bp0) b eco m e read-on l y b its. sr wd is ? 0 ? status at shi p ment. instructions each i n struction starts with a single-byte code, as s u mm ariz ed in th e fo llowing tab l e. if an inv a lid i n stru ctio n is sen t (on e no t con t ain e d in t h e fo llowing tab l e) , t h e de vice aut o matically deselects itself. instruction set ins t ruc t i o n d e s c r i p t i o n ins t ruc t i o n fo rma t w r en w r ite enabl e 000 0 011 0 w rdi w r ite disabl e 000 0 010 0 rdsr read status r egister 000 0 010 1 w r sr w r ite status register 000 0 000 1 read read from me mor y arra y 000 0 001 1 w r it e w r ite to memor y arra y 000 0 001 0 r10ds 0 0 46ej 020 0 rev.2.00 page 9 of 2 0 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a write ena b le (w ren ): th e write en ab le latch (wel) b it m u st b e set p r i o r to each write and wrsr instru ct io n . th e on ly way to do th is is to sen d a write en ab le in st ru ctio n to th e d e v i ce. as sho w n i n th e fo llowing figu re, to sen d th is in st ru ction to th e d e v i ce, chip select ( s ) is d r i v en low, an d th e b its o f th e in stru ction b y te ar e s h i f t e d i n , on seri al dat a i n put ( d ). the de vi ce t h e n en ters a wait st ate. it waits for th e d e vice to be deselected, by chi p select ( s ) bei n g dri v e n hi g h . write ena b le (wren) seq u ence s w c d q instruction 01 2 3 4 5 6 high-z v ih v il v ih v il v ih v il v ih v il 7 r10ds 0 0 46ej 020 0 rev.2.00 page 1 0 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a write disabl e (w r d i): on e way of resettin g th e writ e en ab le latch (wel) b it is t o se n d a wri t e di sabl e i n st r u c t i on t o t h e de vi ce. as s h ow n in th e fo llo wi ng figu re, to send th is in stru ctio n to t h e d e v i ce, ch i p select ( s ) is driv en low, and th e b its o f th e i n stru ctio n b y te are sh ifted in, o n serial d a ta inp u t (d). th e d e v i ce th en en ters a wait state. it waits fo r the de vice to be deselected, by c h ip select ( s ) bei n g dri v en hi g h . t h e write en ab le latch (wel) bit, in fact, b e co mes reset b y an y of t h e fo llowing ev en ts: ? power-up ? wr d i i n st ruct i on e x ec ut i on ? wrsr instru ct io n co m p letio n ? write in stru ctio n co m p letio n write disabl e (wrdi) se quenc e s w c d q instruction 1 0 2 3 4 567 high-z v ih v il v ih v il v ih v il v ih v il r10ds 0 0 46ej 020 0 rev.2.00 page 1 1 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a rea d stat us regis t er ( r d s r) : th e read stat u s reg i ster (rdsr) in stru ctio n allo ws th e statu s register t o be read. t h e stat us re gister m a y be read at an y ti m e , ev en wh ile a write o r write statu s register cycle is in progres s . when on e of t h ese cycles is i n progress , it is recom m ended t o chec k t h e w r i t e in p r o g re ss ( wip ) bi t be fo re se ndi ng a ne w i n st ruct i o n t o t h e de vi ce. i t i s al so p o ssib l e to r e ad th e statu s reg i ster co n tinuou sly, as show n in th e fo llo w i ng f i gu r e . rea d status regis t er (rdsr) sequ en ce s w c d q status register out 01 2 3 4 5 6 7 0 1 2 3 4 5 6 77 8 9 10 11 12 13 14 15 high-z v ih v il v ih v il v ih v il v ih v il th e status an d co n t r o l b its of t h e status regi ster are as follows: wip b it: th e write in prog ress (wip) b it i n d i cates wh ether th e m e m o ry is bu sy with a write o r write statu s reg i ster cycle. when s e t to 1, s u c h a cycl e is in progress. wh en reset to 0, no s u ch cycles are in progre ss. wel b it: th e write en ab le latch (wel) bit in d i cates th e statu s of t h e in t e rn al write enab le latch. wh en set to 1, the in tern al write en ab le latch i s set. when set to 0, th e in te rn al write en able latch is reset an d no write o r write statu s register inst ructions a r e acce pted. bp1 , bp0 b its: th e blo c k pro t ect (bp1 , b p 0 ) b its are n o n - v o l atile. th ey d e fi n e th e size o f th e area to be software p r o t ected ag ainst w r ite instructio n s . th ese b its are written w ith t h e write statu s reg i ster (wrsr ) in st ru ctio n. when one o r b o t h of t h e b l oc k p r ot ect (b p1 , b p 0) bi t s are set t o 1, t h e rel e va nt m e m o ry area ( a s de fi ne d i n t h e wri t e pr ot ect block size tabl e) becom e s protected agai n s t wri t e ( w r i te ) i n st ruct i o ns. the b l oc k pr ot ect (b p1 , b p 0) bi t s ca n be written p r ov id ed th at t h e hardware pro t ected m o d e h a s no t b een set. sr wd b it: the statu s reg i ster write disable (sr w d) b it is op erated in co nju n c tion with th e write pro t ect ( w ) si gnal . the status re gister write dis a bl e ( s r w d) bi t an d wri t e pr ot ect ( w ) signal allo ws t h e dev i ce to b e pu t in th e hardware pr ot ect ed m o d e ( w he n t h e st at us r e gi st er wri t e di sabl e (sr w d ) bi t i s set t o 1, a n d wr i t e pr ot ect ( w ) sig n a l is driv en lo w). in th is mo d e , th e non -vo l atile b its o f th e status reg i ster (sr w d, b p 1 , bp0 ) b e come read -on l y bits an d th e wri te status register (w r s r) i n struction is no longe r acce pted for exec ution. r10ds 0 0 46ej 020 0 rev.2.00 page 1 2 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a write statu s regis t er (wrsr): th e write stat u s reg i ster (wrsr) in st ru cti o n allo ws n e w v a lu es to b e written to th e statu s reg i ster. b e fore it can b e accepted, a write enable (wren) instruction m u st pre v iously ha ve bee n exec uted. aft e r the write enable (wre n) instruction has been dec o ded and exec uted, t h e device sets th e write en ab l e latch (wel). th e i n stru ctio n seq u e n ce is sh ow n i n t h e f o l l o wi ng fi gu r e . t h e wri t e s t at us r e gi st er ( w r s r ) i n st r u c t i on has n o ef f ect on b 6 , b 5 , b4 , b1 an d b 0 of t h e st at us r e gi st er. b 6 , b 5 a n d b4 ar e alway s rea d as 0. c h ip select ( s ) m u st be dri v e n h i gh a f t e r t h e ri si ng e d ge of seri al cl ock (c ) t h at l a t c hes i n t h e ei g h t h bi t of t h e dat a by t e , an d be fo re t h e next ri si n g e dge o f se ri al cl ock (c ). oth e rwise, th e write statu s r e g i ster (w rsr ) in st ru c t i o n i s not e x ec ut ed. as s o on as c h i p sel ect ( s ) i s dri v en hi gh , t h e self-tim ed write statu s reg i st er cycle (whos e duration is t w ) is in itiated . wh ile th e write statu s reg i ster cycle is in pr o g ress , t h e s t at us r e gi st er m a y st i l l be rea d t o chec k t h e value o f the write in p r o g re ss ( wip ) bit. t h e write in pr og ress ( wip ) bit is 1 d u ri n g the self -tim ed write status regi ster cycle, and is 0 when it is com p leted. whe n the cycle is co m p leted , write en ab le latch (wel) i s reset. th e write status re gister (w r s r) i n struction allows t h e user to chan ge t h e val u es of t h e b l oc k p r ot ect (b p 1 , b p 0 ) bi t s , t o d e fi ne t h e size of the area t h at is to be treate d as rea d -only, a s defi ned i n t h e st at us r e gi st er fo rm at t a bl e. the write stat us re gister (wrsr) inst ru cti o n also allows the user t o set or reset t h e sta t us register write disable (sr w d) bit in accorda n ce w ith the write prot ect ( w ) si gnal . t h e st at us r e gi st er wri t e di sabl e ( s r w d) bi t an d wri t e pr ot ect ( w ) si g n al al l o w s t h e devi ce t o be pu t i n t h e ha rd w a re p r ot ect ed m ode ( h pm ) . the wri t e st at us r e gi st er (w rsr ) instructio n is no t ex ecu t ed on ce th e hardware pro t ected mod e (hpm) is en tered . the c o ntents of the status re gister write di sabl e ( s r w d) and b l oc k p r ot ect (b p1 , b p 0) bi t s are f r oze n at t h ei r c u r r e n t v a lu es ju st b e fo re th e start of th e ex ecu tion of th e write st at us r e gi st er ( w r s r ) i n st ruct i o n . the ne w, up dat e d val u es take effect at the m o m e nt of com p letion of t h e e x ecu tion of write statu s reg i ster (wrsr) in stru ction . write statu s regis t er (wrsr) seque nce s w c d q status register in msb 01 2 3 4 5 6 7 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 high-z v ih v il v ih v il v ih v il v ih v il r10ds 0 0 46ej 020 0 rev.2.00 page 1 3 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a rea d from m e m o ry array (rea d ): as sho w n i n the fo llo wi n g figu re, to send t h is in stru ction to th e d e v i ce, ch i p select ( s ) is first driv en low. th e b its of th e in stru ction b y te and th e add r ess b y tes are th en sh ifted in, on se rial data i n p u t (d ). t h e addresses are loade d i n to a n internal a d dres s re gister, a n d t h e byte of data at that address is sh i f ted ou t, o n serial d a ta ou tpu t (q). if c h ip select ( s ) con tin u e s to b e driv en low, th e in tern al add r ess re gister i s aut o m a tically incr em ented, a n d the byte of d a ta at th e n e w add r ess is sh ifted ou t. whe n t h e highest address is reached, the addres s c o unter rolls over to ze ro, allo wing t h e read cycle to be c ontinue d i nde fi ni t e l y . t h e wh ol e m e m o ry ca n, t h ere f ore , be rea d wi t h a si ngl e r e ad i n st r u ct i o n . the rea d cycle is term inated by drivi n g chi p select ( s ) high. t h e rising e d ge of the c h ip s e lect ( s ) signal can occ u r at any tim e during the cycle. t h e a d dresse d first byte ca n be any byte within a n y pa ge. t h e instruction i s not acce pted, an d is n o t ex ecu t ed , if a write cycle is curre n tly in progress . rea d from m e mor y arra y (read) seq u ence s w c d q 16-bit address data out 2 data out 1 01 2 3 4 5 6 7 0 1 2 3 13 14 15 8 9 10 20 21 22 23 24 25 26 27 28 29 30 31 high-z v ih v il v ih v il v ih v il v ih v il 0 1 2 3 4 5 6 77 instruction no te: 1 . th e m e m o ry size is shown in th e fo llowing t a b l e. addr ess ra nge bits de v i c e r 1 e x 2 551 2 a address b i ts a15 to a0 r10ds 0 0 46ej 020 0 rev.2.00 page 1 4 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a write to me m o ry array ( w rite ): as sho w n i n the fo llo wi n g figu res, to sen d this in stru ctio n to th e d e v i ce, ch ip select ( s ) i s first driv en low. th e b its of the instruction byte, address byte, and at leas t one data b y te are th en sh ifted in, o n serial d a ta inp u t (d). th e i n stru ctio n is term in ated b y driv i n g ch i p select ( s ) h i gh at a b y te b ound ar y o f th e i n pu t d a ta. i n th e case of th e f i rst figu re, th is o c cu rs after th e ei g h t h b it of th e d a ta b y te h a s b een latch e d in, in d i catin g th at th e in stru ction is b e ing u s ed t o write a si ngle byte. the self-ti m ed write cycle starts, a n d c ontinues for a peri od t w (as specified in ac characteristics ) . at th e end o f th e cycle, th e write in prog ress (wip) b it i s reset t o 0 . if, though, c h i p select ( s ) con tin u e s to b e driv en low, as sh own in th e se co nd figu re, the n e x t b y te o f th e inpu t d a ta is shi f t e d i n , s o t h at m o re t h a n a si n g l e by t e , s t art i ng fr om t h e gi ve n a d dres s t o war d s t h e e n d o f t h e sam e page , ca n be written i n a si ng le in tern al write cycle. each tim e a n e w d a ta b y te is sh ifted in , th e l east sig n i fican t b its of t h e inte rnal a d dress count er a r e in cr eme n te d . i f th e num ber of dat a by t e s se nt t o t h e devi ce e x ce eds t h e page bo und ar y, th e i n ter n al ad dr ess co un ter ro lls ov er to t h e b e g i n n i n g of t h e p a g e , and th e prev i o u s d a ta t h ere are ov er written with th e i n co m i n g d a ta. (th e p a g e size of th ese d e v i ce is 128 bytes) . the i n struction is not acce pted, a n d is no t executed, under the following c o nditions: ? if t h e write enab le latch (wel) b it h a s no t b e en set t o 1 (b y ex ecu ting a write en ab le i n stru ctio n ju st b e fo re) ? if a write cycle is already i n progress ? if t h e device is deselected ? if t h e a d d r esse d page i s i n t h e re gi o n pr ot ect ed by t h e b l oc k p r ot ect (b p 1 and b p 0) bi t s . b y te write ( w rite ) seq u ence (1 by t e ) s w c d q 16-bit address data byte 1 01 2 3 4 5 6 7 0 1 2 3 13 14 15 8 9 10 20 21 22 23 24 25 26 27 28 29 30 31 high-z v ih v il v ih v il v ih v il v ih v il 4 5 6 7 0 1 2 3 instruction no te: 1 . th e m e m o ry size is shown in th e add r ess ran g e bits tab l e. r10ds 0 0 46ej 020 0 rev.2.00 page 1 5 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a b y te write (write ) seq u ence (page ) s w c d q 16-bit address data byte 1 01 2 3 4 5 6 7 0 1 2 3 13 14 15 8 9 10 20 21 22 23 24 25 26 27 28 29 30 31 high-z v ih v il v ih v il v ih v il v ih v il 4 5 6 7 0 1 2 3 instruction s w c d q data byte 3 data byte n 32 33 34 35 36 37 38 39 7 40 41 42 43 44 45 46 47 high-z v ih v il v ih v il v ih v il 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 6 5 4 3 2 1 0 data byte 2 no te: 1 . th e m e m o ry size is shown in th e add r ess ran g e bits tab l e. r10ds 0 0 46ej 020 0 rev.2.00 page 1 6 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a data protect the protection feature s of t h e device a r e s u mmarized in t h e fo llowing tab l es. when th e st at us r e gi st er wri t e di sabl e (sr w d) b it o f th e status register is 0 (its initial d e liv ery state), it is po ssi b l e to write to t h e status reg i ster pro v i d e d th at th e write en ab le latch (wel) b it h a s prev i o u s ly b een set b y a write en ab le (wren) in stru ction , reg a rd less whet her w r i t e pr ot ect ( w ) i s dri v en hi gh o r l o w. whe n t h e stat us re gister write disable (sr w d) bit of the stat u s reg i ster is set to 1 , two cases n eed to b e co nsid ered , depe n d i n g on t h e st at e of w r i t e p r ot ect ( w ): ? if w r i t e pr ot ect ( w ) is driv en h i gh , it is po ssi b l e to write to t h e status regi ster provi ded that the write e n able lat c h ( w el ) b i t has pre v i o usl y been set b y a write en ab le (wren) i n structio n . ? if w r i t e pr ot ect ( w ) is driv en l o w, it is n o t possib l e to write to th e status register e v en if t h e write e n abl e latch (w el) b it h a s p r ev iou s ly b e en set b y a writ e en ab le (wr e n) in stru ction . (attem p ts t o write to th e statu s register are re jected, a n d are not acce pt ed for e x ecution). as a conse que nce, all the dat a bytes in the me m o ry area that a r e s o ftware protected (spm ) by t h e b l ock pr ot ect (b p1 , b p 0) bi t s o f t h e st at us r e gi st er, a r e al so har d ware p r ot e c t e d agai nst da t a m odi fi cat i o n . r e gar d l e ss of t h e or der o f t h e t w o e v e n t s , t h e ha rd ware p r ot ect ed m o de (h pm ) ca n be e n t e red: ? by settin g th e statu s reg i ster write disab l e (sr w d) b it after driv ing write pro t ect ( w ) l o w . ? b y dri v i n g w r i t e pr ot ect ( w ) lo w after setting th e statu s reg i ster write disab l e (sr w d) b it. the only way t o e x it the hardware protected mode (hpm ) o n c e en tered is to p u ll write pro t ect ( w ) hig h . if w r i t e pr ot ect ( w ) is pe rm anently tied high, the hardware protected mode (hpm) can never be activated, a n d only the so ft ware p r ot e c t e d m o de (sp m ), usi n g t h e b l ock pr ot ect ( b p1, b p 0 ) bi t s o f t h e st at us r e gi st er, ca n b e use d . write pro t ec ted blo ck size statu s reg i ste r b i ts a r r a y ad d r es s es p r o t ected b p 1 b p 0 pro t ected b l ocks r1ex25512 a 0 0 n o n e n o n e 0 1 u p p e r q u a r t e r c000 h ? ffff h 1 0 u p p e r h a l f 800 0 h ? ffff h 1 1 w h o l e memor y 000 0 h ? ffff h protec tion m odes me mory protec t w s i gna l srwd bit mode write prote c t ion of the statu s reg i ste r pro t ected ar e a * 1 u n p r o t ected area * 1 1 0 0 0 1 1 soft w a r e protected (sp m ) status register is w r itabl e (if the w r en instruction has set the w e l bit). t he values in the bp1 and bp0 b i ts can be chan ged. w r ite protected read y to acc e pt w r ite instructions 0 1 hard w a re protected (hp m ) status register is hard w a r e w r ite protected. t he values i n the bp1 an d bp0 bits cann ot be cha nge d. w r ite protected read y to acc e pt w r ite instructions note: 1. as define d b y t he val ues in th e block protect ed ( bp1, bp0) bits of the status regist er, as sho w n i n the w r ite protected bloc k size table. r10ds 0 0 46ej 020 0 rev.2.00 page 1 7 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a hold condition the hold ( hold ) signal is used t o pause any serial communicatio n s with th e d e v i ce with ou t resettin g t h e clo c k i ng sequ en ce.du r i n g th e ho ld con d ition , t h e serial d a ta ou tpu t (q ) is h i gh im p e d a n c e, an d serial d a ta in pu t (d) and serial clo c k (c) are do n?t care.to enter th e ho ld con d ition , t h e d e v i ce m u st b e selected , with ch i p select ( s ) low . norm all y , th e d e v i ce is k e p t selected , fo r th e wh o l e du ration o f th e ho ld co nd itio n. deselectin g th e d e vice wh ile it is i n th e ho ld cond itio n , h a s th e effect o f resetting th e state o f t h e d e v i ce, an d th i s m ech an is m can b e u s ed if it is requ ired t o reset any proce sses that ha d been in progress . th e ho ld con d i tio n starts wh en th e ho ld ( hold ) signal is drive n low at t h e sam e time as serial clock (c ) alrea d y bei n g lo w (as shown in th e fo llo wi ng figu re).th e ho ld con d ition en ds wh en t h e ho ld ( hol d ) si g n a l is driv en h i gh at th e same tim e as serial clock (c) already being low. th e fo llowing figu re also shows wh at h a pp en s if th e rising an d falling ed ges are no t ti m e d to co i n cid e with serial clo c k (c) bein g l o w . hold condition activ a tio n c hold hold status hold status notes da ta protection at v cc on/off whe n v cc is t u rn ed o n or o ff, no ise on s i n put s ge nerat e d by ext e rnal ci r c ui t s (c pu, etc) m a y act as a trigger a n d turn th e eepr o m t o u n i n t en tion a l prog ram m o d e . to p r ev en t this un in ten tion a l p r og rammin g , th is eeprom h a v e a po wer on reset f u nct i o n . b e care f ul of t h e not i ces descri bed bel o w i n or de r f o r t h e p o w er o n re set fu nct i o n t o ope rat e co rrect l y . vcc s ? s sh ou ld b e f i xed to v cc du r i n g v cc on /o ff. low t o h i gh or h i gh to low tran sitio n du ri n g v cc on/ of f m a y cau se t h e trigger for th e un in t e n tio n a l prog rammin g . ? v cc should be turned on/o ff a f ter the eepr o m is placed i n a standby sta t e. ? v cc shou ld b e tu rn ed on f r o m th e g r ou nd level ( v ss ) in o r d e r for th e eepr o m n o t t o en ter th e un in ten tion a l pr o g ram m i ng m ode. ? v cc tu rn on rate shou ld b e sl ower th an 2 s/v. ? whe n wrsr or w r ite i n structio n is e x ec uted be fo re v cc tu rn s o f f, v cc sh oul d be t u r n ed o f f aft e r w a i t i ng write cycle time (t w ). ? wh en settin g t h e ch ip select sig n a l ( s) to t h e lo w lev e l at po wer on , wait fo r 10 m s o r long er after th e sup p l y vol t a ge 1 . 8 v . 1.8v (vccmin) 10ms min r10ds 0 0 46ej 020 0 rev.2.00 page 1 8 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a packag e dimensions r1ex25 512 asa00 a (p rsp0008 df -b / prev ious co de: fp-8 dbv) prsp0008df-b p-sop8-3.9x4.89-1.27 a l e c b d e a b c  x y h z l 2 1 1 e 1 mass[typ.] 0.08g 4.89 1.06 0.25 0 8 6.02 0.15 0.20 0.25 0.45 0.102 0 .14 0.254 3.90 0.406 0 .60 0 .889 1.73 reference symbol dimension in millimeters min n om max previous code jeita package code renesas code fp-8dbv 5.15 1 a p 0.35 0.40 6.20 5.84 1.27 0.10 0.69 index mark e 1 y xm p * 3 * 2 * 1 f 4 85 d e h a z b p terminal cross section ( ni/pd/au plating ) b c detail f 1 1 l l a  note) 1. dimensions" * 1 (nom)"and" * 2" do not include mold flash. 2. dimension" * 3"does not include trim offset. e r10ds 0 0 46ej 020 0 rev.2.00 page 1 9 of 20 oct.04, 2010
r1ex25 512 asa00 a /r1ex2551 2ata00 a r1ex25 512 ata0 0a (pts p0008 jc-b / prev ious co de: ttp-8 dav) a l e c 1 b 1 d e a 2 b p c  x y h e z l 1 3.00 1.00 0.13 0 8 6.40 0.10 0.15 0.20 0.25 0.03 0.07 0.10 4.40 0.40 0.50 0.60 1.10 reference symbol dimension in millimeters min nom max 3.30 a 1 0.15 0.20 6.60 6.20 0.65 0.10 0.805 * 1 85 e * 2 index mark 14 * 3 p m x y f a d e h z b detail f 1 1 a l l  p terminal cross section ( ni/pd/au plating ) c b note) 1. dimensions" * 1 (nom)"and" * 2" do not include mold flash. 2. dimension" * 3"does not include trim offset. e p-tssop8-4.4x3-0.65 0.034g mass[typ.] ttp-8dav ptsp0008jc-b renesas code jeita package code previous code r10ds 0 0 46ej 020 0 rev.2.00 page 2 0 of 20 oct.04, 2010
all trademarks and re gistere d trademarks ar e t he propert y of their respectiv e o w n e rs. revision histor y r1ex 25512asa00a/ r 1ex25512ata 00a data sheet de s c ription re v . d a t e p a g e s u m m a r y 1.00 jan. 15, 20 10 initial issu e 2.00 oct. 04, 2010 appl y to re nes as electron ics' ne w format an d ne w d o cume nt number. additi on of 8-pi n sop packag e . w h ich prod u c t t y p e no. is r1e x 2 551 2as a 00a. c - 1
notice 1. all information included in this document is current as of the date this document is issued. such information, however, is s ubject to change without any prior notice. before purchasing or using any renesas electronics products listed herein, please confirm the latest product information with a renesas electronics sales office. also , please pay regular and careful attention to additional and different information to be disclosed by renesas electronics such as that disclosed through our website. 2. renesas electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property ri ghts of third parties by or arising from the use of renesas electronics products or technical information described in this document. no license, express, implied or otherwise, is granted hereby under any paten ts, copyrights or other intellectual property rights of renesas electronics or others. 3. you should not alter, modify, copy, or otherwise misappropriate any renesas electronics product, whether in whole or in part . 4. descriptions of circuits, software and other related information in this document are provided only to illustrate the operat ion of semiconductor products and application examples. you are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. renesas electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 5. when exporting the products or technology described in this document, you should comply with the applicable export control l aws and regulations and follow the procedures required by such laws and regulations. you should not use renesas electronics products or the technology described in this document for any purpose rela ting to military applications or use by the military, including but not limited to the development of weapons of mass destruction. renesas electronics products and technology may not be used for or incorporate d into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. 6. renesas electronics has used reasonable care in preparing the information included in this document, but renesas electronics does not warrant that such information is error free. renesas electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information incl uded herein. 7. renesas electronics products are classified according to the following three quality grades: "standard", "high quality", an d "specific". the recommended applications for each renesas electronics product depends on the product's quality grade, as indicated below. you must check the quality grade of each renesas electronics produ ct before using it in a particular application. you may not use any renesas electronics product for any application categorized as "specific" without the prior written consent of renesas electronics. fu rther, you may not use any renesas electronics product for any application for which it is not intended without the prior written consent of renesas electronics. renesas electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any renesas electronics product for an application categorized as "specific" or for which the product is not intended wh ere you have failed to obtain the prior written consent of renesas electronics. the quality grade of each renesas electronics product is "standard" unless otherwise expressly specified in a renesas electroni cs data sheets or data books, etc. "standard": computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment ; home electronic appliances; machine tools; personal electronic equipment; and industrial robots. "high quality": transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; safety equipment; and medical equipment not specifically designed for life support. "specific": aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or syst ems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct thr eat to human life. 8. you should use the renesas electronics products described in this document within the range specified by renesas electronics , especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. renesas el ectronics shall have no liability for malfunctions or damages arising out of the use of renesas electronics products beyond such specified ranges. 9. although renesas electronics endeavors to improve the quality and reliability of its products, semiconductor products have s pecific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. further, renesas electronics products are not subject to radiation resistance design . please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a renesas electronics produc t, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measu res. because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system manufactured by you. 10. please contact a renesas electronics sales office for details as to environmental matters such as the environmental compati bility of each renesas electronics product. please use renesas electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, in cluding without limitation, the eu rohs directive. renesas electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 11. this document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of renes as electronics. 12. please contact a renesas electronics sales office if you have any questions regarding the information contained in this doc ument or renesas electronics products, or if you have any other inquiries. (note 1) "renesas electronics" as used in this document means renesas electronics corporation and also includes its majority-o wned subsidiaries. (note 2) "renesas electronics product(s)" means any product developed or manufactured by or for renesas electronics. http://www.renesas.com refer to "http://www.renesas.com/" for the latest and detailed information. renesas electronics america inc. 2880 scott boulevard santa clara, ca 95050-2554, u.s.a. tel: +1-408-588-6000, fax: +1-408-588-6130 renesas electronics canada limited 1101 nicholson road, newmarket, ontario l3y 9c3, canada tel: +1-905-898-5441, fax: +1-905-898-3220 renesas electronics europe limited dukes meadow, millboard road, bourne end, buckinghamshire, sl8 5fh, u.k tel: +44-1628-585-100, fax: +44-1628-585-900 renesas electronics europe gmbh arcadiastrasse 10, 40472 dsseldorf, germany tel: +49-211-65030, fax: +49-211-6503-1327 renesas electronics (china) co., ltd. 7th floor, quantum plaza, no.27 zhichunlu haidian district, beijing 100083, p.r.china tel: +86-10-8235-1155, fax: +86-10-8235-7679 renesas electronics (shanghai) co., ltd. unit 204, 205, azia center, no.1233 lujiazui ring rd., pudong district, shanghai 200120, china tel: +86-21-5877-1818, fax: +86-21-6887-7858 / -7898 renesas electronics hong kong limited unit 1601-1613, 16/f., tower 2, grand century place, 193 prince edward road west, mongkok, kowloon, hong kong tel: +852-2886-9318, fax: +852 2886-9022/9044 renesas electronics taiwan co., ltd. 7f, no. 363 fu shing north road taipei, taiwan tel: +886-2-8175-9600, fax: +886 2-8175-9670 renesas electronics singapore pte. ltd. 1 harbourfront avenue, #06-10, keppel bay tower, singapore 098632 tel: +65-6213-0200, fax: +65-6278-8001 renesas electronics malaysia sdn.bhd. unit 906, block b, menara amcorp, amcorp trade centre, no. 18, jln persiaran barat, 46050 petaling jaya, selangor darul ehsan, malaysia tel: +60-3-7955-9390, fax: +60-3-7955-9510 renesas electronics korea co., ltd. 11f., samik lavied' or bldg., 720-2 yeoksam-dong, kangnam-ku, seoul 135-080, korea tel: +82-2-558-3737, fax: +82-2-558-5141 sales offices ? 2010 renesas electronics corporation. all rights reserved. colophon 1.0


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